Infineon ISP772TFUMA1: Technical Specifications and Application Overview

The Infineon ISP772TFUMA1 is a highly integrated System-in-Package (SiP) power management solution designed to meet the demanding requirements of modern portable and battery-powered applications. Combining a high-efficiency DC-DC buck converter with a low-dropout (LDO) regulator and critical protection features, this component serves as a compact and robust power hub for system-on-chips (SoCs), microprocessors, and ASICs in space-constrained designs.

Technical Specifications

At its core, the ISP772TFUMA1 is engineered for performance and reliability. Its key electrical characteristics include:

Input Voltage Range: 4.5V to 5.5V, making it ideal for systems powered from a standard 5V source, such as a USB port or an external adapter.

Dual Output Channels: It features one high-efficiency step-down (buck) converter and one Low-Dropout (LDO) linear regulator.

The buck converter provides a programmable output voltage, capable of delivering a substantial output current of up to 600mA. Its high switching frequency allows for the use of very small external inductors and capacitors, minimizing the overall solution footprint.

The LDO regulator offers a fixed output voltage and can deliver up to 150mA of current, perfect for powering low-noise analog circuits or serving as a always-on supply rail.

High Efficiency: The integrated buck converter achieves peak efficiency exceeding 90%, which is critical for maximizing battery life and reducing heat dissipation in portable devices.

Comprehensive Protection Suite: The device is built with system durability in mind, incorporating essential protection mechanisms such as thermal shutdown, overcurrent protection (OCP), and under-voltage lockout (UVLO).

Control Interface: It supports I²C communication, enabling dynamic control and programmability of output voltages, power sequencing, and power-saving modes. This allows for fine-tuning the power management strategy in real-time based on processor performance states.

Package: Housed in a compact, space-saving TFBGA-36 package, it is suited for applications where board real estate is at a premium.

Application Overview

The integration and feature set of the ISP772TFUMA1 make it a versatile choice for a wide array of applications. Its primary use is in managing the complex power rails of advanced processors and connectivity modules.

A primary application is in Internet of Things (IoT) devices and smart sensors. These devices often operate from batteries or energy harvesters, where high efficiency is non-negotiable for long operational life. The ability to dynamically scale voltage via I²C helps optimize power consumption during active and sleep modes.

Furthermore, it is an excellent fit for portable consumer electronics such as action cameras, handheld scanners, and advanced remote controls. The SiP integrates multiple power components into a single package, simplifying design, reducing the bill of materials (BOM), and accelerating time-to-market.

It also finds significant use in application processor power management for embedded systems, including single-board computers and human-machine interface (HMI) panels. The combination of a high-current buck converter for the core voltage and an LDO for PLL or memory IO voltage provides a complete power solution in a single chip.

ICGOOODFIND: The Infineon ISP772TFUMA1 stands out as a superior power management IC by masterfully balancing high performance, integration, and compact size. Its high-efficiency buck converter, supplementary LDO, I²C programmability, and robust protection features make it an ideal, all-in-one power solution for designers tackling the challenges of next-generation portable and IoT products.

Keywords: Power Management IC (PMIC), System-in-Package (SiP), High Efficiency, I²C Programmable, IoT Applications.