On July 24, reports confirmed that CXMT has completed LPDDR6 chip sampling for smartphones, with mass production targeted for H2 2026 – potentially beating Samsung and SK Hynix to market. The 16Gb samples deliver 12.8Gbps data rates, exceeding Samsung's disclosed 10.7Gbps first-gen LPDDR6 .

To secure the DDR6 transition, CXMT is upgrading its packaging supply chain, bringing in Haesung DS and shifting from roll-to-roll to panel-level packaging (PLP) – better suited for DDR6's complex multilayer designs . Haesung DS passed CXMT's DDR5 qualification in early 2026 as a validation step before the DDR6 ramp.

Industry consensus places DDR6 commercial deployment around 2028–2029, while Samsung and SK Hynix are diverting wafer capacity to high-margin HBM, creating a structural supply gap in the mobile LPDDR segment – a window CXMT is seizing .

CXMT is now the world's fourth-largest DRAM maker with 7.7–8% global market share, operating 300,000 wafers/month in Hefei. Its products already supply Huawei, Xiaomi, OPPO, Alibaba Cloud, and Tencent Cloud . Separately, Apple is reportedly testing CXMT DRAM for China-market devices – though this remains unconfirmed and would face regulatory and patent hurdles .

From ICgoodFind: CXMT just put LPDDR6 samples on the table – ahead of the incumbents. With H2 2026 mass production in sight, the message is clear: the global DRAM landscape is shifting.